Semiconductor equipment · ASML is the sole supplier
Chips at 7nm and below need EUV lithography, and only ASML makes it at volume; limited annual output and long lead times pace leading-edge capacity.
20 segments · 52 companies
From tools and materials to hyperscaler capex: compute, networking and power must all be ready at once, and any link can become the bottleneck.
Upstream on the left, end demand on the right. Figures are 1-month returns; the segment shows its median.
Median price return of the listed companies in each segment.
Concentrated, hard-to-replace links that can cap the whole chain.
Chips at 7nm and below need EUV lithography, and only ASML makes it at volume; limited annual output and long lead times pace leading-edge capacity.
AI accelerators rely on TSMC leading-edge nodes and CoWoS packaging to join GPU and HBM; CoWoS capacity keeps falling short and caps AI chip shipments.
Only SK hynix, Samsung and Micron make HBM at volume; slow yield and capacity ramps make HBM supply a limit on AI chip shipments.
AI data-center optics need indium phosphide laser chips, whose capacity grows slowly; suppliers say the gap now exceeds DRAM and NAND, pacing optical build-outs.
Data-center and power demand has booked large gas turbines years ahead; few makers can build them and expansion is slow, pacing new generation.
Primary data-center markets have almost no vacant space, and new builds wait on power hookups and construction, so AI deployments queue for capacity.
Hub links every company to its suppliers and customers, with news and alerts as the chain moves.